Indlela yokuhlanganisa i-Optoelectronic

I-Optoelectronicindlela yokuhlanganisa

Ukuhlanganiswa kweizithombekanye ne-elekthronikhi kuyisinyathelo esibalulekile ekuthuthukiseni amakhono ezinhlelo zokucubungula ulwazi, okwenza kube lula amazinga okudluliswa kwedatha okusheshayo, ukusetshenziswa kwamandla okuphansi kanye nemiklamo yamadivayisi amancane kakhulu, kanye nokuvula amathuba amasha amakhulu okuklama uhlelo. Izindlela zokuhlanganisa ngokuvamile zihlukaniswe ngezigaba ezimbili: ukuhlanganiswa kwe-monolithic kanye nokuhlanganiswa kwama-chip amaningi.

Ukuhlanganiswa kwe-Monolithic
Ukuhlanganiswa kwe-monolithic kuhilela ukukhiqiza izingxenye ze-photonic neze-elekthronikhi ku-substrate efanayo, ngokuvamile kusetshenziswa izinto nezinqubo ezihambisanayo. Le ndlela igxile ekudaleni i-interface engenamthungo phakathi kokukhanya nogesi ngaphakathi kwe-chip eyodwa.
Izinzuzo:
1. Nciphisa ukulahlekelwa kokuxhumana: Ukubeka ama-photon nezingxenye ze-elekthronikhi eduze kunciphisa ukulahlekelwa kwesignali okuhlobene nokuxhumeka okungaxhunyiwe ku-chip.
2, Ukusebenza okuthuthukisiwe: Ukuhlanganiswa okuqinile kungaholela ekusheshiseni kokudlulisa idatha okusheshayo ngenxa yezindlela zesignali ezimfushane kanye nokubambezeleka okuncishisiwe.
3, Usayizi omncane: Ukuhlanganiswa kwe-Monolithic kuvumela amadivayisi amancane kakhulu, okuzuzisa kakhulu izinhlelo zokusebenza ezilinganiselwe isikhala, njengezikhungo zedatha noma amadivayisi aphathwayo.
4, nciphisa ukusetshenziswa kwamandla: susa isidingo samaphakheji ahlukene kanye nokuxhumana okude, okunganciphisa kakhulu izidingo zamandla.
Inselele:
1) Ukuhambisana kwezinto: Ukuthola izinto ezisekela ama-electron asezingeni eliphezulu kanye nemisebenzi ye-photonic kungaba yinselele ngoba zivame ukudinga izakhiwo ezahlukene.
2, ukuhambisana kwenqubo: Ukuhlanganisa izinqubo zokukhiqiza ezahlukahlukene ze-elekthronikhi nama-photon ku-substrate efanayo ngaphandle kokwehlisa ukusebenza kwanoma iyiphi ingxenye eyodwa kuwumsebenzi oyinkimbinkimbi.
4, Ukukhiqiza okuyinkimbinkimbi: Ukunemba okuphezulu okudingekayo ezakhiweni ze-elekthronikhi neze-photononic kwandisa ubunzima kanye nezindleko zokukhiqiza.

Ukuhlanganiswa kwama-chip amaningi
Le ndlela ivumela ukuguquguquka okukhulu ekukhetheni izinto nezinqubo zomsebenzi ngamunye. Kulokhu kuhlanganiswa, izingxenye ze-elekthronikhi neze-photonic zivela ezinqubweni ezahlukene bese zihlanganiswa ndawonye bese zifakwa kwiphakheji noma i-substrate evamile (Isithombe 1). Manje ake sibhale izindlela zokubopha phakathi kwama-chip e-optoelectronic. Ukubopha okuqondile: Le ndlela ihilela ukuthintana okuqondile ngokomzimba kanye nokubopha kwezindawo ezimbili ezihleliwe, ngokuvamile okusizwa amandla okubopha ama-molecule, ukushisa, kanye nengcindezi. Inenzuzo yokulula kanye nokuxhumeka okungaba phansi kakhulu kokulahlekelwa, kodwa idinga izindawo eziqondile nezihlanzekile. Ukuhlanganiswa kwe-fibre/grating: Kulesi sikimu, i-fiber noma i-fiber array iqondaniswa futhi ixhunywe emaphethelweni noma ebusweni be-chip ye-photonic, okuvumela ukukhanya ukuthi kuhlanganiswe ngaphakathi nangaphandle kwe-chip. I-grating ingasetshenziswa futhi ekuhlanganiseni okuqondile, ukuthuthukisa ukusebenza kahle kokudluliselwa kokukhanya phakathi kwe-chip ye-photonic kanye ne-fiber yangaphandle. Izimbobo ze-Through-silicon (TSVs) kanye nama-micro-bumps: Izimbobo ze-Through-silicon ziyizixhumanisi eziqondile nge-substrate ye-silicon, okuvumela ama-chip ukuthi abekwe ngezinga ezintathu. Uma zihlanganiswe namaphuzu amancane acwebezelayo, zisiza ekufinyeleleni ukuxhumana kukagesi phakathi kwama-chip kagesi kanye nama-photonic ekucushweni okuhlanganisiwe, okulungele ukuhlanganiswa kobuningi obukhulu. Isendlalelo soxhumano lwe-Optical: Isendlalelo soxhumano lwe-optical siyi-substrate ehlukile equkethe ama-waveguides e-optical asebenza njengomxhumanisi wokuhambisa izimpawu ze-optical phakathi kwama-chip. Ivumela ukuhambisana okunembile, kanye nokunyakaza okwengeziweizingxenye ezibonakalayoingahlanganiswa ukuze kwandiswe ukuguquguquka kokuxhumana. Ukubopha okuhlanganisiwe: Lobu buchwepheshe bokubopha obuthuthukisiwe buhlanganisa ukubopha okuqondile kanye nobuchwepheshe be-micro-bump ukuze kufezwe ukuxhumana kukagesi okunobuningi obukhulu phakathi kwama-chips kanye nezixhumi ze-optical ezisezingeni eliphezulu. Kuthembisa kakhulu ukuhlanganiswa kwe-optoelectronic okusebenza kahle kakhulu. Ukubopha kwe-solder bump: Ngokufana nokubopha kwe-flip chip, ama-solder bumps asetshenziselwa ukudala ukuxhumana kukagesi. Kodwa-ke, esimweni sokuhlanganiswa kwe-optoelectronic, ukunakwa okukhethekile kumele kukhokhwe ekugwemeni ukulimala kwezingxenye ze-photonic okubangelwa ukucindezeleka kokushisa kanye nokugcina ukuhambisana kwe-optical.

Umfanekiso 1: : Uhlelo lokubopha i-electron/photon chip-to-chip

Izinzuzo zalezi zindlela zibalulekile: Njengoba umhlaba we-CMOS uqhubeka nokulandela ukuthuthukiswa koMthetho kaMoore, kuzokwazi ukuvumelanisa ngokushesha isizukulwane ngasinye se-CMOS noma i-Bi-CMOS ku-chip ye-silicon photonic eshibhile, kutholakale izinzuzo zezinqubo ezinhle kakhulu kuma-photonics nakuma-electronics. Ngenxa yokuthi ama-photonics ngokuvamile awadingi ukwenziwa kwezakhiwo ezincane kakhulu (osayizi ababalulekile bama-nanometer angaba yi-100 bavamile) futhi amadivayisi makhulu uma kuqhathaniswa nama-transistors, ukucatshangelwa kwezomnotho kuzovame ukusunduza amadivayisi e-photonic ukuthi akhiqizwe ngenqubo ehlukile, ahlukaniswe nanoma yimaphi ama-electronics athuthukile adingekayo kumkhiqizo wokugcina.
Izinzuzo:
1, ukuguquguquka: Izinto nezinqubo ezahlukene zingasetshenziswa ngokuzimela ukuze kufezwe ukusebenza okuhle kakhulu kwezingxenye ze-elekthronikhi neze-photonic.
2, ukuvuthwa kwenqubo: ukusetshenziswa kwezinqubo zokukhiqiza ezivuthiwe zengxenye ngayinye kungenza kube lula ukukhiqiza futhi kunciphise izindleko.
3, Ukuthuthukiswa nokugcinwa okulula: Ukuhlukaniswa kwezingxenye kuvumela izingxenye ngazinye ukuthi zishintshwe noma zithuthukiswe kalula ngaphandle kokuthinta lonke uhlelo.
Inselele:
1, ukulahleka kokuxhumana: Ukuxhumeka okungaxhunyiwe ku-chip kwethula ukulahleka kwesiginali okwengeziwe futhi kungadinga izinqubo zokuqondanisa eziyinkimbinkimbi.
2, ukwanda kobunzima nosayizi: Izingxenye ngazinye zidinga ukupakishwa okwengeziwe kanye nokuxhumana, okuholela osayizi abakhulu kanye nezindleko ezingaba phezulu.
3, ukusetshenziswa kwamandla okuphezulu: Izindlela ezinde zesignali kanye nokupakishwa okwengeziwe kungandisa izidingo zamandla uma kuqhathaniswa nokuhlanganiswa kwe-monolithic.
Isiphetho:
Ukukhetha phakathi kokuhlanganiswa kwe-monolithic kanye ne-multi-chip kuncike ezidingweni ezithile zohlelo lokusebenza, kufaka phakathi imigomo yokusebenza, imikhawulo yosayizi, izindleko zokucatshangelwa, kanye nokuvuthwa kobuchwepheshe. Naphezu kobunzima bokukhiqiza, ukuhlanganiswa kwe-monolithic kunenzuzo ezinhlelweni zokusebenza ezidinga ukwenziwa kube lula kakhulu, ukusetshenziswa kwamandla aphansi, kanye nokudluliswa kwedatha okusheshayo. Esikhundleni salokho, ukuhlanganiswa kwe-multi-chip kunikeza ukuguquguquka okukhulu kokuklama futhi kusebenzisa amakhono okukhiqiza akhona, okwenza kufaneleke ezinhlelweni zokusebenza lapho lezi zici zidlula izinzuzo zokuhlanganiswa okuqinile. Njengoba ucwaningo luqhubeka, izindlela ezihlanganisiwe ezihlanganisa izici zamasu womabili nazo ziyahlolwa ukuze kuthuthukiswe ukusebenza kohlelo ngenkathi kunciphisa izinselele ezihambisana nendlela ngayinye.