Usebenzisa ubuchwepheshe be-Opoleelyronic Co-Packal Technology ukuxazulula ingxenye enkulu yokuhambisa idatha

UkusebenzisaoptoelectronicUbuchwepheshe bokupakisha ukuxazulula ukuhanjiswa kwedatha okukhulu

Iqhutshwa ukuthuthukiswa kwamandla okukhokhisa ezingeni eliphakeme, inani ledatha liyanda ngokushesha, ikakhulukazi ithrafikhi entsha yezebhizinisi ledatha efana namamodeli amakhulu we-AI kanye nokufunda komshini ukukhuthaza ukukhula kwemininingwane kusuka ekugcineni kuze kube sekupheleni kuze kube sekupheleni nasekubasebenzisi. Idatha enkulu idinga ukudluliswa ngokushesha kuwo wonke ama-engeli, futhi isilinganiso sokudlulisa idatha sesithuthukisiwe kusuka ku-100gbe kuya ku-400gbe, noma ngisho ne-800BE, ukufanisa izidingo zokusebenzisana kwedatha. Njengoba amanani emigqa akhuphukile, ubunzima bezinga lebhodi le-Hardware elihlobene bukhuphuke kakhulu, kanti nendabuko ye-I / O yehluleka ukubhekana nezidingo ezahlukahlukene zokudlulisela amasiginali aphezulu avela kwiphaneli yangaphambili. Kulesi simo, ukuhlanganiswa kwe-CPO Opoleelectronic kufunwa.

Ukucubungula idatha ukufunwa imali, i-CPOoptoelectronicUkunaka

Ohlelweni lokuxhumana lwe-Optical, imodyuli yokubona kanye ne-ACCH (CHIP yokushintsha inethiwekhi) ihlanganiswe ngokwahlukana, kanyeImodyuli ye-OpticalIxhunyiwe kwiphaneli yangaphambili yokushintshwa kwemodi evuthiwe. Imodi yokufaka i-pluggable ayihambi, futhi ukuxhumana okuningi kwendabuko yendabuko kuxhumeke ndawonye kwimodi evunyekayo. Yize kunesiqubulo esisekuqaleni komzila wezobuchwepheshe, imodi yokufaka i-pluggable iveze ezinye izinkinga ngamanani aphezulu wedatha, kanye nobude bokuxhuma, ukulahleka kwamandla, kanye nekhwalithi yejubane kuzonqunyelwa njengoba ijubane lokucubungula idatha lidinga ukwenyuka okwengeziwe.

Ukuze uxazulule izingqinamba zokuxhumana kwendabuko, ukuhlanganiswa kwe-CPO Opoloelectronic Co-Packal sekuqalile ukuthola ukunakwa. Ku-Optics ehlanganisiwe, amamojula we-optical kanye ne-Ais (ama-chip switch chips) ahlanganiswe ndawonye futhi axhunywe ngokuxhumeka kukagesi amafushane, ngaleyo ndlela afinyelele ekuhlanganiseni okuhlangene kwe-opoleelectronic. Izinzuzo zosayizi nesisindo esilethwa yi-CPO Photoelectric Co-Packal zisobala, kanye ne-miniaturization kanye ne-miniaturation yamamojula we-optical aphezulu atholakala. Imodyuli ye-Optical ne-ACCH (I-Chip yokushintsha inethiwekhi) ifakwa phakathi ebhodini, futhi ubude befiber buncishiswe kakhulu, okusho ukuthi ukulahleka ngesikhathi sokudluliselwa kungancishiswa.

Ngokusho kwedatha yokuhlola ye-Ayar Labs, i-CPO Opto-Co-Packaling inganciphisa ngokuqondile ukusetshenziswa kwamandla ngesigamu kuqhathaniswa namamojula we-pluggable optical. Ngokuya kokubala okubanzi, ku-400g speggical module, uhlelo lwe-CPO lungasindisa cishe ama-50% ekusetshenzisweni kwamandla, futhi uma kuqhathaniswa nemodyuli ye-1600g speltical optical, i-CPO Scheme ingonga ukusetshenziswa kwamandla okwengeziwe. Isakhiwo esimaphakathi kakhulu futhi senza ukuncipha kwe-interconnection kukhuphuke kakhulu, ukubambezeleka nokuhlanekezela kwesiginali kagesi kuzothuthukiswa, kanye nokuvinjwa kwejubane lokuhambisa akusekho imodi ye-plugget yendabuko.

Elinye iphuzu yizindleko, ubuhlakani banamuhla bokufakelwa, izinhlelo zeseva kanye nezindlela zokushintshana zidinga ngokushesha okukhulu kanye nesivinini, ngaphandle kokusebenzisa i-CPO co -s, isidingo senombolo enkulu yezixhumi eziphezulu zokuxhuma imodyuli ephezulu, okuyindleko enkulu. Ukupakishwa kwe-CPO kunganciphisa inani lezixhumi nazo ziyingxenye enkulu yokunciphisa i-bom. I-CPO PhotoElectric Co-Packalis ukuphela kwendlela yokuthola isivinini esikhulu, umkhawulokudonsa ophakeme kanye nenethiwekhi yamandla aphansi. Lobu buchwepheshe bokupakisha i-Silicon PhotoElectric Contlents kanye nezinto ze-elekthronikhi ndawonye kwenza imodyuli ye-Optical icishe isondele ku-chip ye-chip ukunciphisa i-chip ye-Chink kanye nokuvuselelwa kwe-interconnentity, ithuthukise kakhulu ukusekelwa kwezobuchwepheshe kokuxhumana kwedatha ephezulu kakhulu ngokuzayo.