Ukuthuthuka kanye nentuthuko ye-CPOi-optoelectronicubuchwepheshe bokupakisha ndawonye
Ukupakisha ngokuhlanganyela kwe-optoelectronic akuyona ubuchwepheshe obusha, intuthuko yayo ingalandelelwa emuva ngawo-1960, kodwa ngalesi sikhathi, ukupakisha ngokuhlanganyela kwe-photoelectric kumane kuyiphakheji elula ye-amadivayisi e-optoelectronicndawonye. Ngawo-1990, ngokukhuphuka kwe-imojuli yokuxhumana ebonakalayoembonini, ukuhlanganiswa kwe-photoelectric kwaqala ukuvela. Njengoba amandla aphezulu ekhompyutha ebangeni eliphezulu kanye nesidingo esikhulu se-bandwidth kulo nyaka, ukuhlanganiswa kwe-photoelectric co-packaging, kanye nobuchwepheshe bamagatsha ahlobene nakho, sekuphinde kwathola ukunakwa okukhulu.
Ekuthuthukisweni kobuchwepheshe, isigaba ngasinye sinezinhlobo ezahlukene, kusukela ku-2.5D CPO ehambisana nesidingo sama-20/50Tb/s, kuya ku-2.5D Chiplet CPO ehambisana nesidingo sama-50/100Tb/s, futhi ekugcineni kufezwe i-3D CPO ehambisana nesilinganiso sama-100Tb/s.
I-2.5D CPO ipakishaimodyuli yokukhanyakanye ne-network switch chip ku-substrate efanayo ukuze kufinyezwe ibanga lomugqa futhi kwandiswe ubuningi be-I/O, kanti i-3D CPO ixhuma ngqo i-optical IC nesendlalelo esiphakathi ukuze kufezwe ukuxhumana kwe-I/O pitch engaphansi kwama-50um. Umgomo wokuvela kwayo ucacile kakhulu, okuwukunciphisa ibanga phakathi kwe-photoelectric conversion module kanye ne-network switching chip ngangokunokwenzeka.
Okwamanje, i-CPO isesencane, futhi kusenezinkinga ezifana nokukhiqiza okuphansi kanye nezindleko zokulungisa eziphezulu, futhi bambalwa abakhiqizi emakethe abangahlinzeka ngokugcwele ngemikhiqizo ehlobene ne-CPO. I-Broadcom, i-Marvell, i-Intel, kanye nabanye abadlali abambalwa kuphela abanezixazululo eziphelele emakethe.
IMarvell yethule ukushintsha kobuchwepheshe be-2.5D CPO kusetshenziswa inqubo ye-VIA-LAST ngonyaka odlule. Ngemva kokuthi i-chip ye-silicon optical icutshungulwe, i-TSV icutshungulwa ngekhono lokucubungula le-OSAT, bese kuthi i-chip flip-chip kagesi ifakwe ku-chip ye-silicon optical. Amamojula angu-16 e-optical kanye ne-chip yokushintsha iMarvell Teralynx7 axhunywe ku-PCB ukuze akhe i-switch, engafinyelela izinga lokushintsha elingu-12.8Tbps.
Ku-OFC yalo nyaka, i-Broadcom ne-Marvell baphinde babonisa isizukulwane sakamuva sama-switch chips angu-51.2Tbps besebenzisa ubuchwepheshe be-optoelectronic co-packaging.
Kusukela esizukulwaneni sakamuva se-Broadcom semininingwane yobuchwepheshe be-CPO, iphakheji ye-CPO 3D ngokuthuthukiswa kwenqubo ukuze kufinyelelwe ukuminyana okuphezulu kwe-I/O, ukusetshenziswa kwamandla kwe-CPO kuya ku-5.5W/800G, isilinganiso sokusebenza kahle kwamandla sisebenza kahle kakhulu. Ngesikhathi esifanayo, i-Broadcom iphinde ifinyelele kugagasi elilodwa le-200Gbps kanye ne-102.4T CPO.
I-Cisco iphinde yandisa ukutshalwa kwezimali kwayo kubuchwepheshe be-CPO, futhi yenza umbukiso womkhiqizo we-CPO ku-OFC yalo nyaka, ikhombisa ukuqongelela kwayo ubuchwepheshe be-CPO kanye nokusetshenziswa kwayo ku-multiplexer/demultiplexer ehlanganiswe kakhulu. I-Cisco ithe izokwenza ukuthunyelwa kwe-CPO kokuhlola kumaswishi angu-51.2Tb, kulandelwe ukwamukelwa okukhulu kumaswishi angu-102.4Tb.
I-Intel sekuyisikhathi eside yethula ukushintsha okusekelwe ku-CPO, futhi eminyakeni yamuva nje i-Intel iqhubekile nokusebenza ne-Ayar Labs ukuhlola izixazululo zokuxhumanisa isignali ye-bandwidth ephezulu ezihlanganiswe ndawonye, ivula indlela yokukhiqizwa okukhulu kwamadivayisi okuhlanganisa ama-optoelectronic kanye nama-optical interconnect.
Nakuba amamojula axhunywayo kuseyisinqumo sokuqala, ukuthuthukiswa kokusebenza kahle kwamandla okujwayelekile okungalethwa yi-CPO kuye kwaheha abakhiqizi abaningi ngokwengeziwe. Ngokusho kwe-LightCounting, ukuthunyelwa kwe-CPO kuzoqala ukwanda kakhulu kusukela kumachweba angu-800G kanye ne-1.6T, kancane kancane kuqale ukutholakala kwezentengiselwano kusukela ngo-2024 kuya ku-2025, futhi kwakha umthamo omkhulu kusukela ngo-2026 kuya ku-2027. Ngesikhathi esifanayo, i-CIR ilindele ukuthi imali engenayo yemakethe yokupakisha okuphelele kwe-photoelectric izofinyelela ku-$5.4 billion ngo-2027.
Ngasekuqaleni konyaka, i-TSMC imemezele ukuthi izosebenzisana ne-Broadcom, i-Nvidia kanye namanye amakhasimende amakhulu ukuthuthukisa ubuchwepheshe be-silicon photonics, izingxenye ezivamile zokupakisha ze-optical CPO kanye neminye imikhiqizo emisha, ubuchwepheshe bokucubungula kusukela ku-45nm kuya ku-7nm, futhi yathi ingxenye yesibili esheshayo yonyaka ozayo yaqala ukuhlangabezana nohlelo olukhulu, cishe ngo-2025 ukuze ifinyelele esigabeni sevolumu.
Njengensimu yobuchwepheshe obuhlanganisa imikhakha eyahlukene ehilela amadivayisi e-photonic, amasekethe ahlanganisiwe, ukupakisha, ukwenza amamodeli kanye nokulingisa, ubuchwepheshe be-CPO bubonisa izinguquko ezilethwa ukuhlanganiswa kwe-optoelectronic, futhi izinguquko ezilethwa ekudlulisweni kwedatha ngokungangabazeki ziyagumbuqela. Nakuba ukusetshenziswa kwe-CPO kungabonakala kuphela ezikhungweni ezinkulu zedatha isikhathi eside, ngokwandiswa okwengeziwe kwamandla amakhulu ekhompyutha kanye nezidingo eziphezulu ze-bandwidth, ubuchwepheshe be-CPO photoelectric co-seal sebube yindawo entsha yempi.
Kungabonakala ukuthi abakhiqizi abasebenza ku-CPO bavame ukukholelwa ukuthi u-2025 uzoba yi-key node, okuyi-node enesilinganiso sokushintshana esingu-102.4Tbps, kanti ukungalungi kwamamojula axhumekayo kuzothuthukiswa kakhulu. Nakuba izinhlelo zokusebenza ze-CPO zingase zifike kancane, ukuhlanganisa ama-opto-electronic ngokungangabazeki kuyindlela kuphela yokufinyelela isivinini esikhulu, i-bandwidth ephezulu kanye namanethiwekhi wamandla aphansi.
Isikhathi sokuthunyelwe: Ephreli-02-2024