Ukuziphendukela kwemvelo kanye nenqubekela phambili ye-CPO Optoelectronic Co-Pack Technology Ingxenye Yesibili

Ukuziphendukela kwemvelo kanye nenqubekela phambili ye-CPOoptoelectronicubuchwepheshe bokuhlanganisa ndawonye

Ukuhlanganiswa kwe-Opoleelectronic akona ubuchwepheshe obusha, ukuthuthukiswa kungalandelelwa emuva ngawo-1960s, kepha ngalesi sikhathi, ukuhlanganiswa kwe-PhotoElectric Co-Packal kuyinto nje elula iphakethe leAmadivayisi we-Optoelectronicndawonye. Ngeminyaka yama-1990s, ngokunyuka kwemodule yokuxhumana ye-OpticalImboni, i-PhotoElectric Cpacking yaqala ukuvela. Ngokuqhuma kwamandla we-computing aphezulu kanye ne-bandwidth ephezulu ye-bandwidth kulo nyaka, ukuhlanganiswa kwe-photoelectric, kanye nobuchwepheshe bawo obuhlobene, kuphinde kwathola ukunakwa okuningi.
Ekuthuthukisweni kobuchwepheshe, isigaba ngasinye sinamafomu ahlukile, kusuka ku-2.5D CPO ehambelana nesidingo esingu-20 / 50TB / s.5D Chipret CPO esihambelana nesilinganiso se-50 / 100tb / ekugcineni, bese ekugcineni sibona i-3D CPO ehambelana nesilinganiso se-100TB / S.

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Amaphakheji we-CPO angama-2.5D aImodyuli ye-OpticalFuthi i-chip ye-chip eshintshiwe ku-substrate efanayo ukufushanisa ibanga lomugqa bese ukhulisa i-I / O density, kanye ne-3D CPO ixhuma ngqo i-IC Optical ukufeza ukuxhumeka kwe-I / O Pitch of the 200. Inhloso yokuziphendukela kwemvelo kwayo kucace bha, okuwukunciphisa ibanga phakathi kwemodyuli yokuguqula isithombe kanye nenethiwekhi eshintsha i-chip ngangokunokwenzeka.
Njengamanje, i-CPO iseseyinsimini yayo, futhi kusenezinkinga ezinjengezimvula eziphansi nezindleko zokugcina okuphezulu, futhi abakhiqizi abambalwa emakethe bangahlinzeka ngokugcwele imikhiqizo ehlobene ne-CPO. I-Broadcom kuphela, iMarvell, i-Intel, futhi idlanzana labanye abadlali linezisombululo eziphelele eziphathelene nemakethe.
UMarvell wethule ubuchwepheshe bezobuchwepheshe be-2.5D CPO usebenzisa inqubo yokugcina ngonyaka owedlule. Ngemuva kokuthi i-silicon optical chip icutshungulwa, i-TSV icutshungulwa ngamandla okusebenza kwe-osat, bese kufakwa i-chip kagesi ye-chip ye-chip ye-silicon optical chip. Amamojula we-Optical kanye nokushintsha i-Chip Marvell Tervellynx7 axhumeke kwi-PCB ukwakha i-switch, engafinyelela isilinganiso sokushintsha kwe-12.8TBPS.

Kulonyaka we-OFC, ebanzi neMarvell kubuye kwabonisa nesizukulwane sakamuva se-51.2TBPS switch chips usebenzisa ubuchwepheshe be-Opoleeryronic Co-Pack Technology.
Ukusuka ekukhiqizeni kwakamuva kwe-CPO yemininingwane yezobuchwepheshe ye-CPO, Iphakheji ye-CPO 3D ngokuthuthuka kwenqubo ukufezekisa inqwaba ye-I / O density, ukusetshenziswa kwamandla kwe-CPO kuya ku-5.5W / 800g, isilinganiso sokusebenza kwamandla sisebenza kahle kakhulu. Ngasikhathi sinye, i-Broadcom nayo iqala ukubhekana negagasi elilodwa lama-200GBPS kanye ne-102.4T CPO.
ICisco iphinde yandisa ukutshalwa kwezimali kwayo ku-CPO Technology, futhi yenza umboniso womkhiqizo we-CPO kulo nyaka we-OFC, ekhombisa ukuqongelela ubuchwepheshe be-CPO kanye nesicelo ku-Multiplexer / DemilplePher yayo. UCisco uthe kuzokwenza ukuthunyelwa komshayeli we-CPO ekushintsheni kwama-51.2TB, kulandelwe ukwamukelwa okuphezulu kwemijikelezo emibili emijikelezweni ye-102.4TB switch
I-Intel yelethule isikhathi eside ukushintshwa kwe-CPO esekwe, futhi eminyakeni yamuva nje i-Intel iye yaqhubeka nokusebenza nama-bandconnection ahlanganisiwe we-bandconnection ahlanganisiwe wokuxhumanisa ama-bandconect, amadivaysi amaningi wokuxhumanisa kanye namadivayisi wokuxhumana.
Yize amamojula axhunyiwe akhona akhona ukukhetha kokuqala, ukuthuthukiswa kwamandla okusebenza kwamandla okuthi i-CPO angaletha ukuheha abakhiqizi abaningi nabangeziwe. Ngokusho kokukhanya, ukuhanjiswa kwe-CPO kuzoqala ukukhuphuka kakhulu kusuka kumachweba angama-800g naku-1.6T, kancane kancane aqala ukuhweba kusuka ngo-2026 kuya ku-2027. Ngasikhathi sinye, i-CIR ilindele ukuthi imali engenayo yemakethe ifinyelela ku- $ 5.4 billion ngo-2027.

Ngasekuqaleni konyaka, i-TSMC imemezele ukuthi izohlangana nezandla nge-Broadcom, Nvidia namanye amakhasimende amakhulu ukuthuthukisa i-75NM ngonyaka olandelayo, futhi bathola ukuthi ihafu lesibili le-Optical, 205 noma ngaphezulu ukuze lifinyelele esigabeni sevolumu.
Njengensimu yezobuchwepheshe ye-Interdisciplinary ehilela amadivaysi e-Photonic, amasekethe ahlanganisiwe, ukupakisha, ukumodela kanye nokulingisa, ubuchwepheshe be-CPO bukhombisa ukuthi izinguquko zilethwe yi-opoleelectronic, futhi ushintsho olulethwa ukudluliswa kwedatha ngokungangabazeki luyahlukana. Yize ukusetshenziswa kwe-CPO kungabonakala kuphela ezikhungweni ezinkulu zedatha isikhathi eside, ngokunwetshwa okwengeziwe kwamandla amakhulu okusebenza kanye nezidingo ze-bandwidth eziphezulu, ubuchwepheshe be-Photoelectric Coalict Coaloelectric Coalict selibe yimpi entsha.
Kungabonakala ukuthi abakhiqizi abasebenza ku-CPO ngokuvamile bakholelwa ukuthi i-2025 izoba yi-node ebalulekile, okubuye kube yindawo yokushintshana kwamamojula angu-102.4TBPs, kanye nobubi amamojula avuthiwe azophinde akhuliselwe. Yize izinhlelo zokusebenza ze-CPO zingahle zifike kancane, ukuhlanganiswa kwe-Opto-electronic ngokungabazeki kuyindlela kuphela yokuthola isivinini esiphezulu, umkhawulokudonsa ophakeme kanye namanethiwekhi aphansi aphansi.


Isikhathi sePosi: APR-02-2024