Ukuziphendukela kwemvelo kanye nenqubekela phambili ye-CPOi-optoelectronicubuchwepheshe bokupakisha ngokubambisana
I-Optoelectronic co-packaging akuwona ubuchwepheshe obusha, ukuthuthukiswa kwayo kungalandelelwa emuva kuma-1960s, kodwa ngalesi sikhathi, ukupakishwa okuhlangene kwezithombe kumane kuyiphakheji elulaamadivaysi e-optoelectronicndawonye. Ngawo-1990, ngokukhuphuka kwe-optical zokuxhumana moduleimboni, i-copackaging ye-photoelectric yaqala ukuvela. Ngokuqhunyiswa kwamandla aphezulu ekhompuyutha kanye nesidingo esikhulu somkhawulokudonsa kulo nyaka, ukupakishwa ngokubambisana kwe-photoelectric, kanye nobuchwepheshe bamagatsha obuhlobene nakho, sekuphinde kwathola ukunakwa okukhulu.
Ekuthuthukisweni kobuchwepheshe, isigaba ngasinye sibuye sibe namafomu ahlukene, kusukela ku-2.5D CPO ehambisana nesidingo esingu-20/50Tb/s, kuya ku-2.5D Chiplet CPO ehambisana nesidingo esingu-50/100Tb/s, futhi ekugcineni siqaphele i-3D CPO ehambisana ne-100Tb/s isilinganiso.
I-2.5D CPO iphasela i-imodeli ye-opticalkanye ne-chip yenethiwekhi ku-substrate efanayo ukuze kufinyezwe ibanga lomugqa futhi kwandise ukuminyana kwe-I/O, futhi i-3D CPO ixhuma ngokuqondile i-IC yokubona kungqimba lomlamuli ukuze kuzuzwe ukuxhumana kwe-I/O pitch engaphansi kuka-50um. Umgomo wokuziphendukela kwemvelo ucacile kakhulu, okuwukunciphisa ibanga phakathi kwemodyuli yokuguqulwa kwesithombe kanye ne-chip yokushintsha inethiwekhi ngangokunokwenzeka.
Njengamanje, i-CPO isencane, futhi kusenezinkinga ezifana nesivuno esiphansi nezindleko eziphezulu zokunakekela, futhi bambalwa abakhiqizi emakethe abangahlinzeka ngokugcwele ngemikhiqizo ehlobene ne-CPO. I-Broadcom, i-Marvell, i-Intel, kanye nedlanzana labanye abadlali kuphela abanezixazululo zokuphathelene ngokugcwele emakethe.
UMarvell wethule ukushintshwa kobuchwepheshe be-2.5D CPO esebenzisa inqubo ye-VIA-LAST ngonyaka odlule. Ngemuva kokuthi i-silicon optical chip isicutshunguliwe, i-TSV icutshungulwa ngamandla okucubungula e-OSAT, bese i-chip flip-chip kagesi yengezwa ku-silicon optical chip. Amamojula angu-16 optical kanye ne-switching chip i-Marvell Teralynx7 axhumene ku-PCB ukuze enze iswishi, engafinyelela izinga lokushintsha elingu-12.8Tbps.
Ku-OFC yalo nyaka, i-Broadcom kanye ne-Marvell baphinde babonisa isizukulwane sakamuva sama-switch chips angu-51.2Tbps kusetshenziswa ubuchwepheshe bokuhlanganisa i-optoelectronic.
Kusukela esizukulwaneni sakamuva se-Broadcom semininingwane yezobuchwepheshe ye-CPO, iphakheji ye-CPO 3D ngokuthuthukiswa kwenqubo ukuze kuzuzwe ukuminyana kwe-I/O okuphezulu, ukusetshenziswa kwamandla e-CPO kuya ku-5.5W/800G, isilinganiso sokusebenza kahle kwamandla ukusebenza okuhle kakhulu kuhle kakhulu. Ngesikhathi esifanayo, i-Broadcom iphinde idlulele kugagasi elilodwa le-200Gbps ne-102.4T CPO.
I-Cisco iphinde yandisa utshalomali lwayo kubuchwepheshe be-CPO, futhi yenza umboniso womkhiqizo we-CPO ku-OFC yalo nyaka, ikhombisa ukuqoqwa kobuchwepheshe bayo be-CPO nokusebenzisa ku-multiplexer/demultiplexer edidiyelwe kakhudlwana. UCisco uthe uzokwenza ukuthunyelwa kokuhlola kwe-CPO kumaswishi angu-51.2Tb, okulandelwa ukwamukelwa ngezinga elikhulu emijikelezweni yokushintsha engu-102.4Tb.
I-Intel sekuyisikhathi eside yethula ukushintsha okusekelwe ku-CPO, futhi eminyakeni yamuva nje i-Intel iqhubekile nokusebenza ne-Ayar Labs ukuze ihlole izixazululo zokuxhumanisa isignali yomkhawulokudonsa ophezulu ohlanganiswe ndawonye, okuvula indlela yokukhiqizwa ngobuningi kokupakishwa okuhlangene kwe-optoelectronic kanye namadivayisi okuxhumana okubona.
Nakuba amamojula axhumekayo eseyinketho yokuqala, ukuthuthukiswa kokusebenza kahle kwamandla okuphelele okungalethwa yi-CPO kuye kwaheha abakhiqizi abaningi. Ngokusho kwe-LightCounting, ukuthunyelwa kwe-CPO kuzoqala ukwanda kakhulu kusuka kumachweba we-800G kanye ne-1.6T, kancane kancane kuqala ukutholakala ngokuhweba kusukela ku-2024 kuya ku-2025, futhi kwakha umthamo omkhulu kusukela ku-2026 kuya ku-2027. Ngesikhathi esifanayo, i-CIR ilindele ukuthi imali yemakethe yokupakishwa okuphelele kwezithombe izofinyelela ku-$5.4 billion ngo-2027.
Ngasekuqaleni konyaka, i-TSMC imemezele ukuthi izosebenzisana ne-Broadcom, i-Nvidia namanye amakhasimende amakhulu ukuthuthukisa ngokuhlanganyela ubuchwepheshe be-silicon photonics, izingxenye ezivamile zokupakisha ze-CPO neminye imikhiqizo emisha, ubuchwepheshe bokucubungula kusuka ku-45nm kuya ku-7nm, futhi yathi ingxenye yesibili esheshayo. wonyaka ozayo waqala ukuhlangabezana ne-oda elikhulu, i-2025 noma ngaphezulu ukuze ifinyelele esigabeni sevolumu.
Njengomkhakha wezobuchwepheshe wemikhakha ehlukene ehlanganisa amadivaysi e-photonic, amasekhethi ahlanganisiwe, ukupakisha, ukumodela nokulingisa, ubuchwepheshe be-CPO bubonisa izinguquko ezilethwa i-optoelectronic fusion, futhi izinguquko ezilethwa ekudluliselweni kwedatha ngokungangabazeki ziyazamazama. Nakuba ukusetshenziswa kwe-CPO kungase kubonakale kuphela ezikhungweni ezinkulu zedatha isikhathi eside, ngokunwetshwa okwengeziwe kwamandla amakhulu ekhompiyutha kanye nezidingo zomkhawulokudonsa ophezulu, ubuchwepheshe be-CPO photoelectric co-seal seal buye baba inkundla yempi entsha.
Kungabonakala ukuthi abakhiqizi abasebenza ku-CPO ngokuvamile bakholelwa ukuthi i-2025 izoba i-node eyinhloko, okubuye kube i-node enezinga lokushintshanisa lika-102.4Tbps, futhi ububi bamamojula axhumekekayo buzothuthukiswa nakakhulu. Nakuba izinhlelo zokusebenza ze-CPO zingase zize kancane, i-opto-electronic co-packaging ngokungangabazeki iwukuphela kwendlela yokufinyelela isivinini esikhulu, umkhawulokudonsa ophezulu kanye namanethiwekhi anamandla aphansi.
Isikhathi sokuthumela: Apr-02-2024