Yethula ukupakishwa kohlelo lwamadivayisi e-optoelectronic
Ukupakishwa kwesistimu yedivayisi ye-OptoelectronicIdivayisi ye-OptoelectronicUkupakishwa kwesistimu kuyinqubo yokuhlanganisa uhlelo ukupakisha amadivayisi e-optoelectronic, izingxenye ze-elekthronikhi kanye nezinto zokusebenza ezisebenzayo. Ukupakishwa kwedivayisi ye-optoelectronic kusetshenziswa kabanzi kuukuxhumana okubonakalayouhlelo, isikhungo sedatha, i-laser yezimboni, isibonisi se-civil optical kanye nezinye izinkambu. Ingahlukaniswa kakhulu ngamazinga alandelayo okupakisha: ukupakisha kwezinga le-chip IC, ukupakisha idivayisi, ukupakisha amamojula, ukupakisha kwezinga lebhodi lesistimu, ukuhlanganiswa kwesistimu engaphansi kanye nokuhlanganiswa kwesistimu.
Amadivayisi e-optoelectronic ahlukile kumadivayisi e-semiconductor ajwayelekile, ngaphezu kokuqukatha izingxenye zikagesi, kunezindlela ze-optical collimation, ngakho-ke isakhiwo sephakheji sedivayisi siyinkimbinkimbi kakhulu, futhi ngokuvamile sakhiwe izingxenye ezincane ezahlukene. Izingxenye ezincane ngokuvamile zinezakhiwo ezimbili, esinye yi-laser diode,umshini wokuthola izithombenezinye izingxenye zifakwe ephaketheni elivaliwe. Ngokusho kokusetshenziswa kwalo, zingahlukaniswa zibe yiphakheji ejwayelekile yezohwebo kanye nezidingo zamakhasimende zephakheji eyimfihlo. Iphakheji ejwayelekile yezohwebo ingahlukaniswa zibe yiphakheji ye-coaxial TO kanye nephakheji ye-butterfly.
Iphakheji ye-1.TO Iphakheji ye-Coaxial ibhekisela ezingxenyeni ze-optical (i-laser chip, i-backlight detector) epayipini, ilensi kanye nendlela ye-optical ye-fiber yangaphandle exhunyiwe ku-axis efanayo eyinhloko. I-laser chip kanye ne-backlight detector ngaphakathi kwedivayisi yephakheji ye-coaxial zifakwe ku-thermic nitride futhi zixhunywe kwisekethe yangaphandle ngentambo yegolide. Ngenxa yokuthi kunelensi eyodwa kuphela ephaketheni le-coaxial, ukusebenza kahle kokuxhuma kuyathuthuka uma kuqhathaniswa nephakheji ye-butterfly. Izinto ezisetshenziselwa igobolondo le-TO tube ikakhulukazi insimbi engagqwali noma i-Corvar alloy. Isakhiwo sonke sakhiwe ngesisekelo, ilensi, ibhulokhi yokupholisa yangaphandle nezinye izingxenye, futhi isakhiwo siyi-coaxial. Ngokuvamile, i-TO packaging i-laser ngaphakathi kwe-laser chip (LD), i-backlight detector chip (PD), i-L-bracket, njll. Uma kukhona uhlelo lokulawula izinga lokushisa lwangaphakathi njenge-TEC, i-thermistor yangaphakathi kanye ne-control chip nazo ziyadingeka.
2. Iphakheji yebhabhathane Ngenxa yokuthi isimo sifana nebhabhathane, leli fomu lephakheji libizwa ngokuthi iphakheji yebhabhathane, njengoba kuboniswe kuMfanekiso 1, isimo sedivayisi yokukhanya yokuvala ibhabhathane. Isibonelo,uvemvane i-SOA(I-1965)i-amplifier ye-optical ye-butterfly semiconductor）. Ubuchwepheshe bephakheji ye-Butterfly busetshenziswa kabanzi ohlelweni lokuxhumana lwe-fiber optical fiber oluhamba ngesivinini esikhulu kanye nokudlulisa ibanga elide. Lunezici ezithile, njengesikhala esikhulu ephaketheni le-butterfly, kulula ukufaka i-semiconductor thermoelectric cooler, futhi lufeze umsebenzi wokulawula izinga lokushisa ohambisanayo; I-laser chip ehlobene, ilensi nezinye izingxenye kulula ukuzihlela emzimbeni; Imilenze yepayipi isatshalaliswa kuzo zombili izinhlangothi, kulula ukuqaphela uxhumano lwesekethe; Isakhiwo silungele ukuhlolwa nokupakishwa. Igobolondo ngokuvamile liyi-cuboid, isakhiwo kanye nomsebenzi wokusebenzisa ngokuvamile kuyinkimbinkimbi kakhulu, kungaba yifriji eyakhelwe ngaphakathi, isinki yokushisa, i-ceramic base block, i-chip, i-thermistor, ukuqapha kwe-backlight, futhi kungasekela ama-bonding lead azo zonke izingxenye ezingenhla. Indawo enkulu yegobolondo, ukushabalalisa okuhle kokushisa.
Isikhathi sokuthunyelwe: Disemba 16-2024