Yethula ukupakishwa kwesistimu yamadivayisi we-optoelectronic

Yethula ukupakishwa kwesistimu yamadivayisi we-optoelectronic

Ukupakishwa kwesistimu yedivayisi ye-OptoelectronicIdivayisi ye-Optoelectronicukupakishwa kwesistimu kuyinqubo yokuhlanganisa uhlelo ukupakisha amadivaysi e-optoelectronic, izingxenye ze-elekthronikhi nezinto zokusebenza ezisebenzayo. Ukupakishwa kwedivayisi ye-Optoelectronic kusetshenziswa kabanzi kuukuxhumana opticaluhlelo, isikhungo sedatha, i-laser yezimboni, i-civil optical display neminye imikhakha. Ingahlukaniswa ikakhulukazi ngamaleveli alandelayo okupakisha: ukupakishwa kwezinga le-chip IC, ukupakishwa kwedivayisi, ukupakishwa kwamamojula, ukupakishwa kwezinga lebhodi lesistimu, ukuhlanganiswa kwesistimu engaphansi kanye nokuhlanganiswa kwesistimu.

Amadivaysi e-Optoelectronic ahlukile kumadivayisi ajwayelekile we-semiconductor, ngaphezu kokuqukatha izingxenye zikagesi, kunezinqubo zokuhlangana kwe-optical, ngakho-ke isakhiwo sephakheji yedivayisi siyinkimbinkimbi kakhulu, futhi ngokuvamile sakhiwe ezinye izingxenye ezincane ezahlukene. Izingxenye ezingaphansi ngokuvamile zinezakhiwo ezimbili, eyodwa ukuthi i-laser diode,i-photodetectorkanti ezinye izingxenye zifakwe ephaketheni elivaliwe. Ngokusho isicelo sayo zingahlukaniswa commercial iphakethe standard kanye nezidingo zamakhasimende iphakethe nokuphathelene. Iphakheji elijwayelekile lezohwebo lingahlukaniswa libe yiphakheji ye-coaxial TO kanye nephakheji ye-butterfly.

Iphakheji ye-1.TO Iphakheji ye-Coaxial ibhekisela ezingxenyeni ezibonakalayo (i-laser chip, isitshina sokukhanya kwangemuva) eshubhuni, ilensi kanye nendlela yokubona ye-fiber yangaphandle exhunyiwe kuku-axis eyinhloko efanayo. I-laser chip ne-backlight detector ngaphakathi kwe-coaxial package device ifakwe ku-thermic nitride futhi ixhunywe kwisekethe yangaphandle ngomthofu wentambo yegolide. Ngenxa yokuthi kunelensi eyodwa kuphela kuphakheji ye-coaxial, ukusebenza kahle kokuhlanganisa kuyathuthukiswa uma kuqhathaniswa nephakheji yovemvane. Izinto ezisetshenziselwa igobolondo le-TO tube ikakhulukazi insimbi engagqwali noma i-Corvar alloy. Isakhiwo sonke sakhiwe isisekelo, ilensi, ibhulokhi yokupholisa yangaphandle nezinye izingxenye, futhi isakhiwo siyi-coaxial. Ngokuvamile, UKUZE kupakishe i-laser ngaphakathi kwe-laser chip (LD), i-backlight detector chip (PD), ubakaki we-L, njll. Uma kunohlelo lwangaphakathi lokulawula izinga lokushisa njenge-TEC, i-thermistor yangaphakathi ne-chip yokulawula nazo ziyadingeka.

2. Iphakheji yovemvane Ngenxa yokuthi umumo ufana novemvane, leli fomu lephakeji libizwa ngokuthi iphakethe uvemvane, njengoba kukhonjisiwe kuMfanekiso 1, umumo wedivayisi yokubona uvemvane evala uphawu. Ngokwesibonelo,uvemvane SOA(butterfly semiconductor optical amplifier）.Ubuchwepheshe bephakheji ye-Butterfly busetshenziswa kakhulu ohlelweni lokuxhumana lwe-optical fiber oluhamba ngesivinini esikhulu kanye nokudlulisa ibanga elide. Inezici ezithile, njengesikhala esikhulu kuphakeji uvemvane, kulula ukukhweza i-semiconductor thermoelectric cooler, futhi ibone umsebenzi ohambisanayo wokulawula izinga lokushisa; I-laser chip ehlobene, ilensi nezinye izingxenye kulula ukuhlelwa emzimbeni; Imilenze yepayipi isakazwa ezinhlangothini zombili, kulula ukubona ukuxhumana kwesifunda; Isakhiwo silungele ukuhlolwa nokupakishwa. Igobolondo ngokuvamile i-cuboid, isakhiwo kanye nomsebenzi wokuqalisa ngokuvamile kuyinkimbinkimbi kakhulu, ingakhelwa ngaphakathi kwesiqandisi, i-heat sink, i-ceramic base block, i-chip, i-thermistor, i-backlight monitoring, futhi ingasekela ukuholela kokubopha kuzo zonke izingxenye ezingenhla. Indawo enkulu yegobolondo, ukuchithwa okuhle kokushisa.