Wethula ukufakwa kohlelo kwamadivayisi we-opoleelyronic
I-OptoElectronic System PackagingIdivayisi ye-OptoElectronicUkupakishwa kwesistimu kuyinqubo yokuhlanganiswa kwesistimu yokupakisha amadivayisi we-Optoelectronic, izakhi ze-elekthronikhi kanye nezinto zohlelo lokusebenza ezisebenzayo. I-OptoElectronic Idivaysi yedivaysi isetshenziswa kabanzi ku-Ukuxhumana kwe-OpticalIsistimu, isikhungo sedatha, i-laser yezimboni, isibonisi sombango sobuso kanye nezinye izinkambu. Ingahlukaniswe ngamazinga alandelayo wokupakisha: Ukupakishwa kwezinga le-Chip IC, ukupakishwa kwedivayisi, ukufakwa kwemodyuli, ukupakishwa kwezinga le-System, ukuhlanganiswa kohlelo.
Amadivayisi we-Optoelectronic ahlukile kumadivayisi we-semiconductor ajwayelekile, ngaphezu kokuqukethe izingxenye zikagesi, kukhona izindlela zokulinganisa ezibonakalayo, ngakho-ke ukwakheka kwephakheji kwensiza kuyinkimbinkimbi ngokwengeziwe, futhi kuvame ukwakhiwa ezinye izakhi ezihlukile. Izakhi ezingezansi zivame ukuba nezakhiwo ezimbili, enye yile ukuthi i-laser diode,I-PhotoDETETETETECETETETFuthi ezinye izingxenye zifakwe kwiphakheji elivaliwe. Ngokokufaka isicelo sayo kungahlukaniswa ngephakethe elijwayelekile lezentengiselwano kanye nezidingo zamakhasimende zephakeji yokuphathelene. Iphakethe elijwayelekile lezentengiselwano lingahlukaniswa libe yi-coaxial libe iphakethe nephakheji levemvane.
Iphakheji ye-FACK COAXIAL isho izakhi ze-optical (chip ye-laser, umtshina we-backlight) ku-tube, ilensi nendlela yokukhanya yefayibha yangaphandle exhunyiwe ku-axis efanayo. I-Laser Chip kanye ne-Backlight Detector ngaphakathi kwe-Coaxial Package yedivaysi ifakwe kwi-Thermic NITRIDE futhi ixhunywe kwisekethe yangaphandle nge-Gold Wire Fihore. Ngoba kunelensi eyodwa kuphela kwiphakeji ye-coaxial, ukusebenza kahle okuhambisana nakho kuyathuthukiswa uma kuqhathaniswa nephakethe levemvane. Izinto ezisetshenziselwa i-gebhu yeshubhu ikakhulukazi yensimbi engenasici noma i-corvar alloy. Lonke isakhiwo sakhiwa ngesisekelo, i-lens, ibhulokhi yokupholisa yangaphandle nezinye izingxenye, futhi isakhiwo se-coaxial. Imvamisa, ukupakisha i-laser ngaphakathi kwe-laser chip (ld), i-backlight detector chip (PD), i-l-bracket, njll. Uma kukhona uhlelo lwangaphakathi lokulawula izinga lokushisa njenge-TEC, i-thermistor yangaphakathi nokulawula i-chip iyadingeka.
2 Ngokwesibonelo,I-Butterfly Soa(I-Butterfly semiconductor amplifier) I-.Butterfly Package Technology isetshenziswa kabanzi ngesivinini esikhulu kanye nohlelo olude lokuhambisa i-fiber system. Inezici ezithile, njengendawo enkulu kwiphakheji yevemvane, kulula ukukhweza i-semiconductor ye-tempeelectric epholile, futhi ibone umsebenzi wokulawula wokushisa okuhambisanayo; I-Chip ye-laser ehlobene, i-lens nezinye izinto kulula ukuhlelwa emzimbeni; Imilenze yamapayipi isatshalaliswa nhlangothi zombili, okulula ukubona ukuxhumana komjikelezo; Isakhiwo silungele ukuhlolwa nokupakisha. Igobolondo livame ukuthi i-Culoid, ukwakheka kanye nokuqalisa ukusebenza kuvame ukuba yinkimbinkimbi, kungakhiwa-ku-isiqandisi, i-ceramic sink block, i-chip, i-thermistor, ukubhekwa kwe-backlight, futhi kungasekela ukuhola izibopho zazo zonke izinto ezingenhla. Indawo enkulu yegobolondo, ukudicilela phansi okuhle kokushisa.
Isikhathi sePosi: Dece-16-2024