Optoelectronicindlela yokuhlanganisa
Ukuhlanganiswa kweizithombeFuthi ama-elekthronikhi isinyathelo esiyisihluthulelo sokwenza ngcono amakhono ezinhlelo zokulungisa ulwazi, enika amandla amanani okudluliselwa kwedatha ngokushesha, ukusetshenziswa kwamandla okuphansi kanye nemiklamo emihle yedivayisi, nokuvula amathuba amasha wedivayisi. Izindlela zokuhlanganisa zihlukaniswe ngezigaba ezimbili: Ukuhlanganiswa kweMonolithic kanye nokuhlanganiswa okuningi kwe-chip.
Ukuhlanganiswa kweMonolithic
Ukuhlanganiswa kweMonolithic kufaka phakathi izakhi ze-Photonic ne-elekthronikhi ku-substrate efanayo, kuvame ukusebenzisa izinto ezihambisanayo nezinqubo. Le ndlela igxile ekwakheni ukuxhumana komthungo phakathi kokukhanya nogesi ngaphakathi kwe-chip eyodwa.
Izinzuzo:
1. Yehlisa ukulahleka kokuxhumana
2, Ukusebenza okuthuthukile: Ukuhlanganiswa okunzima kungaholela ekuhambeni okusheshayo kwe-Data yokudluliswa kwemali ngenxa yezindlela ezimfishane zesiginali nokunciphisa i-latency.
I-3, usayizi omncane: Ukuhlanganiswa kweMonolithic kuvumela amadivayisi acwebezelayo kakhulu, okuzuzisa kakhulu izinhlelo zokusebenza ezikhawulelwe isikhala, njengezikhungo zedatha noma amadivaysi aphathwayo.
4, Yehlisa ukusetshenziswa kwamandla: Qeda isidingo samaphakeji ahlukile kanye nokuxhumeka okude okuhlobene, okunganciphisa kakhulu izidingo zamandla.
Inselelo:
1) Ukuvumelana okubonakalayo: Ukuthola izinto zokweseka ama-elektroni asezingeni eliphakeme kanye nemisebenzi ye-Photonic kungaba inselelo ngoba imvamisa idinga izakhiwo ezahlukene.
2, ukuhambisana kwenqubo: Ukuhlanganisa izinqubo zokukhiqiza ezahlukahlukene ze-elekthronikhi kanye nama-photon ku-substrate efanayo ngaphandle kokudicilela phansi ukusebenza kwanoma iyiphi ingxenye eyodwa kuwumsebenzi oyinkimbinkimbi.
4, Ukukhiqiza okuyinkimbinkimbi: Ukucaciswa okuphezulu okudingekayo kwizakhiwo ze-elekthronikhi nezokwenza izithombe kwandisa ubunzima kanye nezindleko zokukhiqiza.
Ukuhlanganiswa kwe-Multi-Chip
Le ndlela ivumela ukuguquguquka okukhulu ekukhetheni izinto zokwakha nezinqubo zomsebenzi ngamunye. Kulokhu okuhlanganisiwe, izakhi ze-elekthronikhi kanye ne-photonic ziqhamuka ezinqubweni ezahlukahlukene futhi ziqoqene ndawonye futhi zibekwe kwiphakeji elijwayelekile noma i-substrate (isithombe 1). Manje ake sibhale izindlela zokubopha izibopho phakathi kwama-opoleeryronic. Ukubopha Okuqondile: Le ndlela ifaka ukuxhumana ngqo ngokomzimba kanye nokubhidlizwa kwezindawo ezimbili zeplanethi, okuvame ukuqondiswa amabutho ama-molecular molecular, ukushisa, kanye nengcindezi. Inenzuzo yokulula nokuxhumeka okuphansi kakhulu kokulahlekelwa, kepha kudinga indawo efanelekile futhi ehlanzekile. I-Fibreg / Coupless: Kulesi sikimu, i-fiber noma i-fiber array iqondaniswe futhi ihlanganiswe emaphethelweni noma ngaphezulu kwe-chip photonic, evumela ukukhanya ku-chip. I-grating nayo ingasetshenziselwa ukuhlanganisa mpo, kuthuthukise ukusebenza kahle kokukhanya phakathi kwe-chip photonic ne-fiber yangaphandle. Nge-Silicon Holes (TSVS) kanye nama-Micro-Bumps: Izimbobo ze-silicon ziqonde mpo ngokuxhumanisa okuthe xaxa nge-silicon substrate, okuvumela ama-chip ukuthi afakwe ngezilinganiso ezintathu. Kuhlanganiswe namaphoyinti ama-micro-convex, asiza ukufeza ukuxhumana kukagesi phakathi kwama-chip e-elektroniki nama-photoshini ekucushweni okugcwele, alungele ukuhlanganiswa okuphezulu. Isendlalelo se-Optical intermediorediary: Isendlalelo se-Optical Arimemediorediary iyi-substrate ehlukile equkethe ama-wavegcuides we-optical asebenza njengomlamuli wokuhambisa amasiginali we-optical phakathi kwama-chip. Ivumela ukuhambelana okuqondile, kanye nokwengeziwe kwe-passIzakhi ze-OpticalIngahlanganiswa ukuze ikhuphuke ukuguquguquka kokuxhumeka. I-Hybrid Bonding: Lokhu kuhlanganisa ubuchwepheshe obuthuthukile bobumbano kuhlanganisa ubudlelwane obuqondile nobuchwepheshe be-micro-bump ukufezekisa ukuxhumeka kukagesi okuphezulu phakathi kwama-chips kanye nezindawo eziphakeme ze-optical. Ithembisa ikakhulukazi ukuhlanganiswa kokuqina kwe-opoleelectronic. I-Soler Bump Bonding: Ifana ne-Flip Chip Bonding, i-soler bumps isetshenziselwa ukudala ukuxhumana ngogesi. Kodwa-ke, kumongo wokuhlanganiswa kwe-opoleelectronic, kufanele kubhekwe ukunakwa okukhethekile ekugwemeni ukulimala kwezinto ze-photonic ezibangelwa ukucindezelwa okushisayo nokugcina ukuqondanisa okubonakalayo.
Umdwebo 1:: I-Electron / Photon Chip-to-Chip-Chip-Chip Bonding Scheme
Izinzuzo zalezi zindlela zibalulekile: Njengoba umhlaba we-CMOS uqhubeka nokulandela ukuthuthuka emthethweni we-Moore, kuzokwazi ukuvumelanisa isizukulwane ngasinye sama-CMO Chip noma i-BI-CMOS ku-chip eshibhile ye-silicon photonics, uthole izinzuzo zezinqubo ezinhle kakhulu ze-Photonics kanye ne-elekthronikhi. Ngoba izithombe ngokuvamile azidingi ukwabiwa kwezinhlaka ezincane kakhulu (osayizi abalulekile be-100 nama-nanometers ajwayelekile) futhi amadivaysi aqhathaniswa namadivaysi ahlukile azokwenziwa kwinqubo ehlukile, ahlukaniswe nanoma yimaphi ama-elekthronikhi athuthukile adingekayo kumkhiqizo wokugcina.
Izinzuzo:
1, Ukuvumelana nezimo: Izinto ezahlukahlukene nezinqubo zingasetshenziswa ngokuzimela ukuze kufinyelelwe ukusebenza okuhle kakhulu kwezinto ezisebenza ngogesi nezokwenza izithombe.
2, 2, ukucubungula ukuvuthwa: ukusetshenziswa kwezinqubo zokukhiqiza ezivuthiwe zengxenye ngayinye kungakwenza lula ukukhiqizwa nokunciphisa izindleko.
I-3, ukuthuthuka okulula kanye nokulungiswa: Ukuhlukaniswa kwezakhi kuvumela izingxenye ngazinye ukuthi zizothathelwa indawo noma zithuthukiswe kalula ngaphandle kokuthinta lonke uhlelo.
Inselelo:
1, Ukulahleka kwe-interconConnection: Ukuxhumeka kwe-Off-Chip kwethula ukulahleka kwesiginali okwengeziwe futhi kungadinga izinqubo zokuqondanisa eziyinkimbinkimbi.
2, ukunwetshwa kobunzima nosayizi: Izingxenye ngazinye zidinga ukufakwa okwengeziwe nokuxhumeka, okuholela kosayizi abakhudlwana nezindleko eziphakeme.
3, ukusetshenziswa kwamandla okuphezulu: izindlela ezinde zesiginali kanye nokupakishwa okwengeziwe kungakhuphula izidingo zamandla uma kuqhathaniswa nokuhlanganiswa kwe-monolithic.
Isiphetho:
Ukukhetha phakathi kokuhlanganiswa kwe-monolithic kanye ne-multi-chip kuncike kwizidingo eziqondene nohlelo lokusebenza, kufaka phakathi izinhloso zokusebenza, izingqinamba zosayizi, ukucatshangelwa kwezindleko, kanye nokuvuthwa kobuchwepheshe. Naphezu kokukhiqizwa kwezinkinga, ukuhlanganiswa kwe-monolithic kuzuzisa izinhlelo zokusebenza ezidinga okuncane kakhulu, ukusetshenziswa kwamandla okuphansi, kanye nokuhanjiswa kwedatha ephezulu. Esikhundleni salokho, ukuhlanganiswa kwama-chip-chip amaningi kunikeza ukuguquguquka okude kakhulu futhi kusebenzisa amakhono okukhiqiza akhona, okwenza kube lula ukuthola izinhlelo zokusebenza lapho lezi zinto zidlula khona izinzuzo zokuhlanganiswa kwe-traght. Njengoba ucwaningo luqhubeka, izindlela ezi-hybrid ezihlanganisa izakhi zawo masu womabili futhi ziyahlolisiswa ukwenza kahle ukusebenza kohlelo ngenkathi kunciphisa izinselelo ezihambisana nendlela ngayinye ehlotshaniswa nendlela ngayinye.
Isikhathi sePosi: Jul-08-2024