Indlela yokuhlanganisa ye-Optoelectronic

I-Optoelectronicindlela yokuhlanganisa

Ukuhlanganiswa kweizithombefuthi izinto zikagesi ziyisinyathelo esibalulekile sokuthuthukisa amakhono ezinhlelo zokucubungula ulwazi, okuvumela amazinga okudlulisa idatha asheshayo, ukusetshenziswa kwamandla okuphansi kanye nemiklamo yedivayisi ehlangene, nokuvula amathuba amasha amakhulu okwakhiwa kwesistimu. Izindlela zokuhlanganisa ngokuvamile zihlukaniswa ngezigaba ezimbili: ukuhlanganiswa kwe-monolithic kanye nokuhlanganiswa kwe-multi-chip.

Ukuhlanganiswa kwe-Monolithic
Ukuhlanganiswa kwe-Monolithic kuhilela ukukhiqiza izingxenye ze-photonic kanye ne-electronic ku-substrate efanayo, ngokuvamile kusetshenziswa izinto ezihambisanayo nezinqubo. Le ndlela igxile ekudaleni ukuxhumana okungenamthungo phakathi kokukhanya nogesi ngaphakathi kwe-chip eyodwa.
Izinzuzo:
1. Nciphisa ukulahlekelwa kokuxhumanisa: Ukubeka ama-photon nezingxenye ze-elekthronikhi eduze kunciphisa ukulahlekelwa kwesignali okuhlotshaniswa nokuxhumeka kwe-off-chip.
I-2, Ukusebenza okuthuthukisiwe: Ukuhlanganiswa okuqinile kungaholela esivinini sokudlulisa idatha ngenxa yezindlela ezimfushane zesignali kanye nokubambezeleka okuncishisiwe.
3, Usayizi omncane: Ukuhlanganiswa kwe-Monolithic kuvumela amadivayisi ahlangene kakhulu, okuzuzisa kakhulu izinhlelo zokusebenza ezinomkhawulo wesikhala, njengezikhungo zedatha noma amadivayisi aphathwa ngesandla.
4, nciphisa ukusetshenziswa kwamandla: susa isidingo samaphakheji ahlukene kanye nokuxhumana okude, okunganciphisa kakhulu izidingo zamandla.
Inselelo:
1) Ukuhambisana kwezinto: Ukuthola izinto ezisekela kokubili ama-electron ekhwalithi ephezulu nemisebenzi yezithombe kungaba inselele ngoba ngokuvamile zidinga izakhiwo ezihlukile.
2, ukuhambisana kwenqubo: Ukuhlanganisa izinqubo zokukhiqiza ezihlukene zama-elekthronikhi nama-photons ku-substrate efanayo ngaphandle kokululaza ukusebenza kwanoma iyiphi ingxenye eyodwa kuwumsebenzi oyinkimbinkimbi.
4, Ukukhiqiza okuyinkimbinkimbi: Ukunemba okuphezulu okudingekayo kwezakhiwo ze-elekthronikhi ne-photononic kukhulisa ubunkimbinkimbi nezindleko zokukhiqiza.

Ukuhlanganiswa kwe-Multi-chip
Le ndlela ivumela ukuguquguquka okukhulu ekukhetheni izinto nezinqubo zomsebenzi ngamunye. Kulokhu kuhlanganiswa, izingxenye ze-elekthronikhi nezithombe zivela ezinqubweni ezahlukene bese zihlanganiswa ndawonye futhi zibekwe kuphakheji evamile noma i-substrate (Umfanekiso 1). Manje ake sibhale izindlela zokuhlanganisa phakathi kwama-optoelectronic chips. Isibopho esiqondile: Le nqubo ihilela ukuthintana okuqondile ngokomzimba nokuhlangana kwezindawo ezimbili eziqondile, ngokuvamile okwenziwa amandla okuhlanganiswa kwamangqamuzana, ukushisa, nokucindezela. Inenzuzo yobulula kanye nokuxhumeka okungenzeka kube nokulahlekelwa okuphansi kakhulu, kodwa idinga izindawo eziqondaniswe ngokunembile nezihlanzekile. Ukuhlanganisa i-fiber/grating: Kulolu hlelo, i-fiber noma i-fiber array iqondaniswe futhi iboshwe onqenqemeni noma ngaphezulu kwe-photonic chip, okuvumela ukukhanya ukuthi kuhlanganiswe ngaphakathi nangaphandle kwe-chip. Igridi ingase futhi isetshenziselwe ukuhlanganisa mpo, ukuthuthukisa ukusebenza kahle kokudluliselwa kokukhanya phakathi kwe-photonic chip kanye nefayibha yangaphandle. Ngezimbobo ze-silicon (ama-TSV) nama-micro-bumps: Izimbobo ze-silicon zixhumeka mpo nge-silicon substrate, okuvumela ama-chips ukuthi apakishwe ngobukhulu obuthathu. Kuhlanganiswe namaphoyinti ama-micro-convex, asiza ukufeza ukuxhumana kukagesi phakathi kwama-chip e-elekthronikhi nawe-photonic ekuhlelweni okustakiwe, okulungele ukuhlanganiswa kokuminyana okuphezulu. Isendlalelo se-Optical intermediary: Isendlalelo se-optical intermediary yi-substrate ehlukile equkethe amagagasi okukhanya asebenza njengomlamuli wokuhambisa amasignali okubona phakathi kwama-chip. Ivumela ukuqondanisa okunembayo, kanye ne-passive eyengeziweizingxenye ze-opticalingahlanganiswa ukuze kuthuthukiswe ukuxhumana nezimo. I-Hybrid bonding: Lobu buchwepheshe bokubambisana obuthuthukisiwe buhlanganisa ubuchwepheshe bokuxhumanisa okuqondile kanye nobuchwepheshe be-micro-bump ukuze kuzuzwe ukuxhumana kukagesi okuxinene kakhulu phakathi kwama-chips kanye nezindawo zokusebenzelana zekhwalithi ephezulu. Kuyathembisa ikakhulukazi ukuhlanganiswa kokusebenza okuphezulu kwe-optoelectronic. I-solder bump bonding: Ngokufanayo ne-flip chip bonding, ama-solder bumps asetshenziselwa ukudala ukuxhumana kukagesi. Kodwa-ke, kumongo wokuhlanganiswa kwe-optoelectronic, ukunakwa okukhethekile kufanele kukhokhwe ukuze kugwenywe ukulimala ezingxenyeni ze-photonic ezibangelwa ukucindezeleka okushisayo nokugcina ukuqondanisa kwe-optical.

Umfanekiso 1: : Isikimu se-Electron/photon chip-to-chip Bonding

Izinzuzo zalezi zindlela zibalulekile: Njengoba umhlaba we-CMOS uqhubeka nokulandela ukuthuthukiswa koMthetho kaMoore, kuzokwazi ukuvumelanisa ngokushesha isizukulwane ngasinye se-CMOS noma i-Bi-CMOS kucwecwe elishibhile le-silicon photonic, ukuvuna izinzuzo zezinqubo ezihamba phambili photonics kanye electronics. Ngenxa yokuthi ama-photonics ngokuvamile awadingi ukwenziwa kwezakhiwo ezincane kakhulu (osayizi abakhulu abangaba ama-nanometer angu-100 ajwayelekile) futhi amadivayisi makhulu uma kuqhathaniswa nama-transistors, ukucatshangelwa kwezomnotho kuzothambekela ekuphusheni amadivaysi e-photonic ukuthi akhiqizwe ngenqubo ehlukile, ehlukaniswe nanoma iyiphi i-Advanced. izinto zikagesi ezidingekayo kumkhiqizo wokugcina.
Izinzuzo:
I-1, ukuguquguquka: Izinto ezihlukahlukene nezinqubo zingasetshenziswa ngokuzimela ukuze kuzuzwe ukusebenza okuhle kakhulu kwezingxenye ze-electronic kanye nezithombe.
2, inqubo yokuvuthwa: ukusetshenziswa kwezinqubo zokukhiqiza ezivuthiwe zengxenye ngayinye kungenza ukukhiqiza kube lula futhi kunciphise izindleko.
3, Ukuthuthukiswa nokugcinwa okulula: Ukuhlukaniswa kwezingxenye kuvumela izingxenye ngazinye ukuthi zishintshwe noma zithuthukiswe kalula ngaphandle kokuthinta lonke uhlelo.
Inselelo:
I-1, ukulahleka koxhumano: Ukuxhumeka kwe-off-chip kwethula ukulahlekelwa kwesignali okwengeziwe futhi kungase kudinge izinqubo zokuqondanisa eziyinkimbinkimbi.
2, ukwanda kobunzima nosayizi: Izingxenye ngazinye zidinga ukupakishwa okwengeziwe nokuxhumana, okuholela kumasayizi amakhulu kanye nezindleko ezingase zibe phezulu.
3, ukusetshenziswa kwamandla okuphezulu: Izindlela zesignali ezinde kanye nokupakishwa okwengeziwe kungase kukhuphule izidingo zamandla uma kuqhathaniswa nokuhlanganiswa kwe-monolithic.
Isiphetho:
Ukukhetha phakathi kokuhlanganiswa kwe-monolithic kanye ne-multi-chip kuncike ezimfuneko eziqondene nohlelo lokusebenza, okufaka phakathi imigomo yokusebenza, imikhawulo yosayizi, ukucatshangelwa kwezindleko, nokuvuthwa kobuchwepheshe. Naphezu kobunzima bokukhiqiza, ukuhlanganiswa kwe-monolithic kunenzuzo ezinhlelweni ezidinga ukwenziwa kancane ngokwedlulele, ukusetshenziswa kwamandla okuphansi, nokudluliswa kwedatha ngesivinini esikhulu. Esikhundleni salokho, ukuhlanganiswa kwe-multi-chip kunikeza ukuguquguquka okukhulu komklamo futhi kusebenzisa amakhono akhona okukhiqiza, okuwenza afaneleke izinhlelo zokusebenza lapho lezi zici zedlula izinzuzo zokuhlanganisa okuqinile. Njengoba ucwaningo luqhubeka, izindlela ezixubile ezihlanganisa izici zawo womabili amasu nazo ziyahlolwa ukuze kuthuthukiswe ukusebenza kwesistimu kuyilapho kuncishiswa izinselele ezihlobene nendlela ngayinye.